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Thermal Conductive Grease Silicone Thermal Paste 25g 30g GD900 GD780 GD32 Heatsink Compound For PC/CPU/GPU/LED/VGA

10.0013.00

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20g GD100 CN2020g GD220 CN2020g GD32 CN2020g GD450 CN2020g GD460 CN2025g GD33 CN2525g GD66 CN2530g GD280 CN3030g GD370 CN3030g GD380 CN3030g GD600 CN3030g GD750 CN3030g GD760 CN3030g GD770 CN3030g GD900 1 CN3030g GD900 CN30
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Name: Filling thermal conductive silicon
Purpose: Fill the gap between the heating element and the heat dissipation device, increase the contact area between them, and transmit more heat to the heat dissipation device, thereby reducing the temperature of the heating element.

Usage: First clean the surface of the heating element and heat dissipation device, and then use a tool to evenly apply thermal conductive silicone grease to the surface of the heating element. It is recommended to apply 1 gram of thermal conductive silicone grease every 20 square centimeters. The surface of the heat dissipation device does not need to be coated.

Thermal Conductive Grease Silicone Thermal Paste  25g 30g GD900 GD780 GD32 Heatsink Compound For PC/CPU/GPU/LED/VGA
Thermal Conductive Grease Silicone Thermal Paste  25g 30g GD900 GD780 GD32 Heatsink Compound For PC/CPU/GPU/LED/VGAThermal Conductive Grease Silicone Thermal Paste  25g 30g GD900 GD780 GD32 Heatsink Compound For PC/CPU/GPU/LED/VGAThermal Conductive Grease Silicone Thermal Paste  25g 30g GD900 GD780 GD32 Heatsink Compound For PC/CPU/GPU/LED/VGA

Weight 11 kg
Dimensions 5 cm
Brand Name

NoEnName_Null

DIY Supplies

ELECTRICAL

Origin

Mainland China

Type

Silicone Sealant

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