Name: Filling Thermal Conductive Silicon
Purpose: Fill the gap between the heating element and the heat dissipation device, increase the contact area between them, and conduct more heat to the heat dissipation device, thereby reducing the temperature of the heating element.
Purpose: Fill the gap between the heating element and the heat dissipation device, increase the contact area between them, and conduct more heat to the heat dissipation device, thereby reducing the temperature of the heating element.
Usage: First clean the surface of the heating element and heat dissipation device, then use a tool to evenly apply thermal grease to the surface of the heating element. It is recommended to apply 1 gram of thermal grease every 20 square centimeters. The surface of the heat dissipation device does not need to be coated.
Packing list
1 piece
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